In addition to its broad portfolio of packaged semiconductors, Fairchild offers its customers the flexibility of using bare die for their designs. Carrier options include unsawn wafer, sawn wafer-on-film, and tape and reel.
For automotive applications, the
Known Good Die (KGD)
process combines high volume manufacturing and assembly processes with extensive testing and inspection to assure highest quality and reliability.
Fairchild can also create new die products for qualifying customers, including utilizing its existing package part portfolio. For information regarding product details or die availability, please contact a Fairchild sales representative or one of our authorized die distributors below.